EVG Wafer Bond Aligner

FOM Name:  FURN Wafer Bond Aligner
Model:  EVG EV 620
Contact: Kurt Kupcho (kkupcho@wisc.edu, 608-262-2982)
Center:  NFC
Location: Engineering Centers Building 3rd Floor Cleanroom

The EV 620 is a separate component from the wafer bonder designed for wafer-to-wafer alignment of 100mm wafers.  This is a desktop system with a manual stage for backside alignment method.  This method has a resolution of ± 2µm.  After alignment, the bonding process is completed in the EVG 501 bonding unit.

This instrument has material restrictions.  Consult the allowed materials list for this instrument in FOM.

 

This is an accordion element with a series of buttons that open and close related content panels.

Configuration

  • 100mm wafers
  • For Si-glass wafer alignment

Limitations

  • Aligning Si-Glass
  • 100mm wafers only
  • Backside wafer must be glass to see thru for alignment