AG Rapid Thermal Annealer

FOM Name:  FURN Rapid Thermal Annealer
Make/Model:  AG Assoc, Heatpulse 610 Rapid Thermal Anneal system
Contact: Frank Flack, 608-265-3148
Center: NFC
Location: Engineering Centers Building 3rd Floor Cleanroom

The Heatpulse 610 is a rapid thermal system that uses high-intensity visible radiation to heat single wafers for 1-600 seconds.

This instrument has material restrictions.  Consult the allowed materials list for this instrument in FOM.

This is an accordion element with a series of buttons that open and close related content panels.


  • The temperature range is 100 – 800ºC and controlled with thermocouple temperature sensor.
  • The heating rate is user controlled at 1–200ºC per second.
  • The chamber is cooled using nitrogen gas.
  • The MFC-controlled process gases are nitrogen and 5% hydrogen balanced in nitrogen.
  • The quartz wafer tray is sized for a 3 or 4-inch wafer.
  • Small pieces are processed on a carrier Si wafer.