Instruments Available
Microscopy and Analysis
Microscopy
- Bruker Icon Atomic Force Microscope
- FEI Helios G4 Plasma FIB/FESEM/EBSD/EDS
- Zeiss Auriga FIB/FESEM/EBSD/EDS
- Leica optical microscope with phase contrast imaging
- Zeiss LEO 1550VP FESEM/EDS
- Zeiss LEO 1530-1 FESEM/EDS/EBSD
- Zeiss Gemini 300 FESEM/EDS/EBSD
- Zeiss Gemini 450 FESEM/EDS
- FEI Tecnai T-12 Cryo TEM
- FEI Tecnai TF 30 TEM
- FEI Titan 80-200 Aberation Corrected (S)TEM/EDS/EELS
- NanoMegas ASTAR TEM Orientation Imaging System
- Zygo New View 9000 Optical Profilometer
X-ray Analysis
- Bruker D8 Discovery X-ray diffractometer
- Panalytical Empyrean X-ray diffractometer
- Panalytical XPert MRD X-ray diffractometer
Sample Preparation
- Tousimis Critical Point Dryer
- Leica ACE600 Sputter Deposition system
- Denton DV-502A Metal Evaporator
- TEM Dimpler
- Fischione 1050 TEM Ion Mill
- Fischione 1040 TEM Ion Mill
- FEI Helios G4 UX Plasma Dual Beam FIB
- 60 °C Oven
- Spincoater Laurell
- Parylene Coater
- Vacuum Oven E1
- Crosslinker XL-1500 254 nm
- Crosslinker XL-1500 365 nm
- Glove Box VAC Nexus One
- Gold Chrom Evaporator Veeco CNTech
- Gold Sputterer
- Hot Plate CEE 1100
- Microblaster Comco MB1002
- Vacuum Oven Labline
- Plasma Etch System PlasmaEtch PE-200
Spectroscopy
- Horiba NanologSpectrofluorometer
- Horiba LabRAM HR Evolution Raman Spectrometer
- Horiba Glow Discharge Optical Emission Spectrometer GD Profiler-2
- Thermo K alpha X-ray Photoelectron Spectrometer
- UV VIS Spectrometer Perkin-Elmer Lambda 10
- UV VIS NIR Spectrometer Perkin-Elmer Lambda 19
- FTIR Nicolet Magna 550 with NicPlan IR microscope
- FTIR Nicolet 6700 spectrometer
- FTIR Nicolet iS50R with PM-IRRAS
- Raman Imaging Microscope Thermo Scientific DXRxi
- Cameca IMS 4f-E7 Secondary Ion Mass Spectrometer
Mechanical Test
- Bruker Hysitron PI85 SEM Pico Indenter
- Bruker Hysitron PI95 TEM Pico Indenter
- Bruker Hysitron TI-950 Triboindenter
- Advanced Rheometric Expansion System (Rheometer) TA Instruments ARES
- Dynamic Mechanical Analyzer (DMA) TA Instruments RSA III
Soft Materials Characterization
- Differential Scanning Calorimeter (DSC) PerkinElmer 8000
- Differential Scanning Calorimeter (DSC) TA Instruments Q100
- Gel Permeation Chromatograph (GPC) Beckman Gold
- Gel Permeation Chromatograph (GPC) Viscotek GPCmax
- Gel Permeation Chromatograph (GPC) Waters
- Gel Permeation Chromatograph (GPC) Waters Alliance
- Thermogravametric Analyzer (TGA) TA Instruments Q500
- Contact Angle Measurement System OCA15EC
- Malvern Zetasizer Nano ZSP
- Quartz Crystal Microbalance Biolin Scientific Q-Sense E4
- Ellipsometer Woollam IR-VASE
- Ellipsometer Woollam V-VASE
- Ellipsometer Rudolph AutoEl NIR 3
- Ellipsometer Rudolph AutoEl VIS 3
- Ellipsometer Verity
- Thin Film Measurement System Filmetrics F20
- Refractometer Leica AR600
- Lightscattering Brookhaven
- Tensiometer Kruss K10T
- Vacuum Tensiometer SMCL
- Capillary Viscometer Schott
- Analytical Balance
Nanofabrication
ADDITIVE PROCESS INSTRUMENTATION
- NFC Dielectric Evaporator
- NFC Indium Evaporator
- NFC Metal Evaporator
- CVC Sputter Deposition
- Denton Sputter Deposition
- PlasmaTherm PECVD/Dielectric RIE Etcher
- Non-Lithography spin coater
- Veeco Fiji G2 Atomic Layer Deposition
METROLOGY INSTRUMENTATION
- Superior Electronics 4-pt Probe Station for sheet resistance measurement
- Tencor Alpha-step 200 Profilometer
- KLA-Tencor P7 Profilometer
- Filmetrics F20 Reflectometer
- Tencor FLX-2320 Thin Film Stress Measurement
- Nikon L200 Optical Microscope
- Nikon and Wild Image capture cameras
- Circuit Board UV electrical tester
PACKAGING AND ASSEMBLY INSTRUMENTATION
- Suss Diamond Scribe station
- DISCO automated wafer saw
- MEI Die Attacher
- K&S Gold Ball Wire Bonder
- Westbond Wedge Aluminum Wire Bonder
PATTERNING PROCESS INSTRUMENTATION
- Elionix E-beam Lithography
- Heidelberg Laser Lithography
- Suss MJB3 Lithography Aligner 1
- Suss MJB3 Lithography Aligner 2
- Suss MA6 Lithography Aligner
- Nikon i-Line Stepper
- Solvent / Develop Bench for Photoresist
- Solvent Bench for SU-8
- Liftoff Photoresist Solvent Wet Bench
- Develop Wet Bench for Electron Beam Lithography
- Photoresist Spinner 1
- Photoresist Spinner 2-including SU8
- Photoresist Spinner 3
- Photoresist Spinner for Electron Beam Lithography
- Hotplate for SU-8 Photoresist
- HMDS Primer
- UV circuit board printer
SUBTRACTIVE PROCESS INSTRUMENTATION
- PlasmaTherm ICP III-V Plasma Etcher
- PlasmaTherm ICP General Plasma Etcher
- PlasmaTherm ICP Metal Plasma Etcher
- PlasmaTherm PECVD/Dielectric RIE Etcher
- Yes Plasma Asher
- PlasmaTherm Reactive Ion Etcher
- STS Deep Reactive Ion Si Etcher
- Samco UV/Ozone Cleaner
- SPTS XeF2 Etcher
- Al Etch Wet Bench
- KOH Wet Bath 1
- KOH Wet Bath 2 – relaxed materials restrictions
- Nitride Etch Wet Bench
- Piranha Etch Wet Bench
- BOE / HF Wet Bench
- III-V Corrosives Wet Bench
- Corrosives Wet Bench
- Pre-Furnace Clean Wet Bench
THERMAL PROCESS INSTRUMENTATION
- MRL Tube 1 High Temp Anneal Furnace
- MRL Tube 2 High Temp Oxidation Furnace
- MRL Tube 3 Low Temp Oxidation Furnace
- MRL Tube 4 Low Temp Anneal Furnace
- MRL Tube 6 Unique Anneal Furnace
- Tystar High Temp Oxidation Furnace
- Tystar LPCVD Nitride furnace
- Tystar LPCVD Polysilicon furnace
- AG Rapid Thermal Annealer
- AccuThermo AW610 Rapid Thermal Annealer
- NFC Package Annealer
- Cooke Vacuum Annealer
- Labline Polymer Oven
- YES Vacuum Oven