The package annealer is for heating the solid connection layer, usually indium, between the die and package to its eutectic point, and then cooling back to room temperature to permanently attach the die to the package. The instrument accomplishes this under vacuum with optional backfill gases.
This instrument has material restrictions. Consult the allowed materials list for this instrument in FOM.
This is an accordion element with a series of buttons that open and close related content panels.
- N2 backfill gas
- Forming gas backfill
- Throttle valve pressure control
- Air cooling back to room temperature
- Maximum temperature of 200C
- Samples smaller than 1in.2