FOM Name: Hot Plate CEE 1100
Model: CEE 1100
Contact: Anna Kiyanova (anna.kiyanova@wisc.edu, 608-263-1735)
Center: SMCL
Location: B48 Engineering Hall
CEE Model 1100 benchtop hot plate allows operator to bake wafers (or any flat objects) using three bake methods: proximity, soft contact, and hard contact. User programs containing bake ramp and soak temperatures, bake time, and bake method can be stored in battery backed memory for later use.
This is an accordion element with a series of buttons that open and close related content panels.
Configuration
- Wafer size: up to 6″ (diameter).
- Temperature range: 300 °C max
- User programs: 10
- Inert gas: nitrogen
- Heater power: 1500 W
