FOM Name: ETCH YES Downstream Asher
Make/Model: YES CV200RFS
Contact: Ming-Wei Lin: mlin227@wisc.edu, (608) 890-4573
Center: NFC
Location: Engineering Centers Building 3rd Floor Cleanroom
This tool uses RF power to generate the plasma which is adjustable to support photoresist strip, descum, surface modification and plasma clean applications. It comes with a heating chuck for the temperature up to 250C and a 40 KHz RF power generation for exciting the plasma. With its downstream configuration the plasma must pass through a grounded, perforated plate to reach product substrates. The grounded plate serves to balance the charge in the plasma and shield sensitive devices from damaging UV exposure.
This instrument has material restrictions. Consult the allowed materials list for this instrument in FOM.
This is an accordion element with a series of buttons that open and close related content panels.
Configuration
- O2 gas
- Dry mechanical pump
Limitations
1000 W RF power maximum
