Suss Diamond Scribe station

FOM Name:  PKG Diamond Scribe
Contact: Frank Flack, 608-265-3148
Center: NFC
Location: Engineering Centers Building 3rd Floor Cleanroom

The Diamond Scribe tool has a diamond-tipped scribe that is dragged across a wafer creating a scratch in the wafer surface.  When the wafer is stressed, the wafer separates along the scribe lines.  The breaks follow the crystal structure of the wafer, creating a right-angle edge on the die.

This instrument has material restrictions.  Consult the allowed materials list for this instrument in FOM.

This is an accordion element with a series of buttons that open and close related content panels.


  • The RA120M has two independent scribing axes that are programmed separately.
  • The system is microprocessor controlled to accurately place the scribe lines with a precise force on the diamond tip.
  • Three scribing modes are available: continuous, edge and skip.
  • The parameters can be entered as either microns or mils for scribing wafers up to 100 mm (4 in.) in diameter.
  • Display message prompt a user through the sequence of scribing steps.



  • Will not scribe wafers greater than 100mm in diameter.