FOM Name: DEP Denton Sputterer
Make/Model: Denton Discovery 24
Contact: Kurt Kupcho, 608-262-2982
Center: NFC
Location: Engineering Centers Building 3rd Floor Cleanroom
Sputtering is a type of physical vapor deposition, which is an additive process.
The Denton Discovery 24 is a research grade sputter deposition system for non-toxic materials. It is a multi-cathode system configured in a con-focal, sputter-down manner.
Due to safety and contamination considerations, materials allowed in this tool are restricted. See the list of allowed materials in FOM.
This is an accordion element with a series of buttons that open and close related content panels.
Configuration
- The system has two DC magnetron target stations and two target stations switchable between RF or DC.
- A 200mm diameter palette to hold the samples for deposition.
- The system is capable of performing an RF pre-clean on the substrate
- The substrate can be biased during deposition.
- The deposition may occur from multiple cathodes simultaneously in order to achieve a film which is a mixture of multiple targets.
- A quartz lamp to heat the wafers before or during deposition.
- High vacuum is achieved by a cryo-pump.
- Oxygen, nitrogen, and argon are available as sputter gases, and can be mixed in any ratio desired.
- Targets available:
| Aluminum (Al) | *Silicon Dioxide (SiO2) |
| Chromium (Cr) | *ITO (In2O3+10%SnO2) |
| Titanium (Ti) | *Zinc Oxide (ZnO) |
| Tungsten (W) | *Titanium Dioxide (TiO2) |
| Silver (Ag) | *Aluminum Oxide (Al2O3) |
| *Silicon Nitride (Si3N4) | |
| *RF cathode only |
Limitations
- Max Sample Size is 200mm Wafer. Wafers or substrate pieces are allowed.
- Max Temperature of the heater is 300 deg. C.
- Maximum film dep thickness is 800nm.
- Power to the targets is limited to the material or bonding method.
