Denton Sputter Deposition

FOM Name:  DEP Denton Sputterer
Make/Model: Denton Discovery 24
Contact: Kurt Kupcho, 608-262-2982
Center: NFC
Location: Engineering Centers Building 3rd Floor Cleanroom

Sputtering is a type of physical vapor deposition, which is an additive process.

The Denton Discovery 24 is a research grade sputter deposition system for non-toxic materials.  It is a multi-cathode system configured in a con-focal, sputter-down manner.

Due to safety and contamination considerations, materials allowed in this tool are restricted. See the list of allowed materials in FOM.

This is an accordion element with a series of buttons that open and close related content panels.


  • The system has two DC magnetron target stations and two target stations switchable between RF or DC.
  • A 200mm diameter palette to hold the samples for deposition.
  • The system is capable of performing an RF pre-clean on the substrate
  • The substrate can be biased during deposition.
  • The deposition may occur from multiple cathodes simultaneously in order to achieve a film which is a mixture of multiple targets.
  • A quartz lamp to heat the wafers before or during deposition.
  • High vacuum is achieved by a cryo-pump.
  • Oxygen, nitrogen, and argon are available as sputter gases, and can be mixed in any ratio desired.
  • Targets available:
Aluminum (Al) *Silicon Dioxide (SiO2)
Chromium (Cr) *ITO (In2O3+10%SnO2)
Titanium (Ti) *Zinc Oxide (ZnO)
Tungsten (W) *Titanium Dioxide (TiO2)
Silver (Ag) *Aluminum Oxide (Al2O3)
*Silicon Nitride (Si3N4)
*RF cathode only



  • Max Sample Size is 200mm Wafer. Wafers or substrate pieces are allowed.
  • Max Temperature of the heater is 300 deg. C.
  • Maximum film dep thickness is 800nm.
  • Power to the targets is limited to the material or bonding method.