Physical vapor deposition (PVD) is a method for producing high quality solid materials, typically in the form of thin films. It is an additive process used in nanofabrication.
PVD describes a variety of vacuum deposition methods which can be used to produce thin films and coatings. PVD is characterized by a process in which the material to be applied goes from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputtering and evaporation.
PVD is used in the creation of structures which require thin films for mechanical, optical, chemical or electronic functions.
This is an accordion element with a series of buttons that open and close related content panels.
Instrumentation Available
- Denton Discovery 24 sputterer
- CVC-601
- Metal evaporator
- Dielectric evaporator
- Indium evaporator
Key Attributes
- Selecting the species and flow rates of precursor gases allows precise control of film composition.
- Adjusting deposition time, temperature, and pressure allows precise control of film thickness and other film properties, such as stress.
Strengths
- Selecting the species and flow rates of precursor gases allows precise control of film composition.
- Adjusting deposition time, temperature, and pressure allows precise control of film thickness and other film properties, such as stress.
Limitations
- LPCVD processes take place at high temperatures, require exceptionally clean samples, and work best on whole, round wafers
- PECVD processes take place at moderately high temperatures
Applications
Additional Reading
