FOM Name: DEP Metal Evaporator
Make/Model: NFC Fabricated
Contact: Kurt Kupcho, 608-262-2982
Center: NFC
Location: Engineering Centers Building 3rd Floor Cleanroom
Evaporation is an additive process.
The Metal Evaporator is a physical vapor deposition system that uses an electron beam as the heat source to melt materials for deposition of thin films on substrates.
Due to safety and contamination considerations, materials allowed in this tool are restricted. See the list of allowed materials in FOM.
This is an accordion element with a series of buttons that open and close related content panels.
Configuration
- Uses a Telemark focused electron beam hearth and power supply.
- High vacuum is achieved by a cryo-pump.
- The hearth holds 4 – 7cc crucibles.
- A crystal oscillator is used to monitor the film thickness in-situ.
- This evaporation system has three substrate holders: a stationary dome for six 4-inch wafers; a stationary dome for twelve 3-inch wafers; and a platen that holds a single insert for a wafer or smaller samples.
- Source Material available:
| Copper (Cu) | |
| Chromium (Cr) | |
| Titanium (Ti) | |
| Gold (Au)
Gold/Germanium (Au/Ge) |
|
| Silver (Ag)
Germanium (Ge) Iron (Fe) Silicon (Si) |
Limitations
- The system is for depositing non-toxic materials.
- Only Metals are allowed in the tool, no dielectrics.
- Maximum film dep thickness is 800nm.
