Lesker Dielectric Evaporator

FOM Name:  DEP Lesker Dielectric Evaporator
Make/Model:  Lesker PVD 200 Pro Line Ebeam Evaporator
Contact: Kurt Kupcho, 608-262-2982
Center: NFC
Location: Engineering Centers Building 3rd Floor Cleanroom

E-beam evaporation is a physical vapor deposition (PVD) technique used to deposit thin films of metals, dielectrics, and other materials with high purity and density. In this process, a focused high-energy electron beam is directed onto the surface of a solid source material (known as the source) inside a high-vacuum chamber. The kinetic energy of the electrons is converted into heat upon impact, causing the localized region of the material to melt and evaporate.  The evaporated atoms or molecules then travel in straight lines through the vacuum and condense onto a substrate, forming a thin film. Because the beam can be precisely controlled, only the desired material is evaporated while the surrounding crucible remains relatively cool, minimizing contamination.

E-beam evaporation is especially suited for materials with high melting points (e.g., refractory metals, oxides, ceramics) that cannot be easily evaporated using conventional thermal sources. Film thickness and deposition rate are typically monitored in real time with a quartz crystal microbalance (QCM).

This instrument has material restrictions.  Consult the allowed materials list for this instrument in FOM.