FOM Name: DEP Lesker Sputterer
Make/Model: Lesker PVD 75 Pro Line Sputter Tool
Contact: Kurt Kupcho, 608-262-2982
Center: NFC
Location: Engineering Centers Building 3rd Floor Cleanroom
Sputtering is a type of physical vapor deposition, which is an additive process.
The Lesker PVD 75 is a research grade sputter deposition system for non-toxic materials. It is a multi-cathode system configured for sputter-up deposition.
Due to safety and contamination considerations, materials allowed in this tool are restricted. See the list of allowed materials in FOM.
This is an accordion element with a series of buttons that open and close related content panels.
Configuration
- Stand alone tool with integrated touch screen computer
- Dry pump for roughing
- Cryo pump for hi-vac
- Computer controlled via software
- 4 mag keeper cathodes for quick target changes
- All 4 cathodes are switchable between DC & RF
- Sample rotation
- Sample heating to 350C
- Process gases of Ar and N2
- Sputter up
Limitations
- 6” diameter wafers or smaller
- Both process pressure and Ar flow cannot be independently controlled, only one
- Power allowed to the targets is limited, based upon the material or bonding method
- Maximum thickness allowed is 800nm
