NFC Instrumentation
Additive Process Instrumentation
- Fiji Atom Layer Deposition system
- NFC Dielectric Evaporator
- NFC Indium Evaporator
- NFC Metal Evaporator
- CVC Sputter Deposition
- Denton Sputter Deposition
- PlasmaTherm PECVD/Dielectric RIE Etcher
- Non-Lithography spin coater
Metrology Instrumentation
Packaging and Assembly Instrumentation
- Suss Diamond Scribe station
- DISCO Automated wafer saw
- MEI Die Attacher
- K&S Gold Ball Wire Bonder
- Westbond Wedge Aluminum Wire Bonder
Patterning Process Instrumentation
- Heidelberg Laser Lithography
- Elionix E-beam Lithography
- Suss MJB3 Lithography Aligner 1
- Suss MJB3 Lithography Aligner 2
- Suss MA6 Lithography Aligner
- Nikon i-Line Stepper
- Solvent / Develop Bench for Photoresist
- Solvent Bench for SU-8
- Liftoff Photoresist Solvent Wet Bench
- Develop Wet Bench for Electron Beam Lithography
- Photoresist Spinner 1
- Photoresist Spinner 2-including SU8
- Photoresist Spinner 3
- Photoresist Spinner for Electron Beam Lithography
- Hotplate for SU-8 Photoresist
- HMDS Primer
- UV circuit board printer
Subtractive Process Instrumentation
- PlasmaTherm ICP III-V Plasma Etcher
- PlasmaTherm ICP General Plasma Etcher
- PlasmaTherm ICP Metal Plasma Etcher
- PlasmaTherm PECVD/Dielectric RIE Etcher
- Yes Plasma Asher
- PlasmaTherm Reactive Ion Etcher
- STS Deep Reactive Ion Si Etcher
- Samco UV/Ozone Cleaner
- SPTS XeF2 Etcher
- Al Etch Wet Bench
- KOH Wet Bath 1
- KOH Wet Bath 2 – relaxed materials restrictions
- Nitride Etch Wet Bench
- Piranha Etch Wet Bench
- BOE / HF Wet Bench
- III-V Corrosives Wet Bench
- Corrosives Wet Bench
- Pre-Furnace Clean Wet Bench
Thermal Process Instrumentation
- MRL Tube 1 High Temp Anneal Furnace
- MRL Tube 2 High Temp Oxidation Furnace
- MRL Tube 3 Low Temp Oxidation Furnace
- MRL Tube 4 Low Temp Anneal Furnace
- Tystar High Temp Oxidation Furnace
- Tystar LPCVD Nitride furnace
- Tystar LPCVD Polysilicon furnace
- AG Rapid Thermal Annealer
- AccuThermo AW610 Rapid Thermal Annealer
- NFC Package Annealer
- Cooke Vacuum Annealer
- Labline Polymer Oven
- YES Vacuum Oven
FOM Names
- Elionix E-beam Lithography
- CLAS 4-pt Probe
- CLAS Corrosives Bench
- CLAS E-beam Develop Wet Bench
- CLAS Fiji ALD
- CLAS E-beam Photoresist Spinner
- CLAS L200 Microscope
- CLAS Thermtec Metal Anneal Furnace
- DEP Angstrom Evaporator DEPOSIT
- DEP CVC Sputter DEPOSIT
- DEP Denton Sputter DEPOSIT
- DEP Dielectric Evaporator DEPOSIT
- DEP KLA-Tencor Alpha-step 200 Profilometer
- DEP KLA-Tencor P7 Profilometer
- DEP Metal Evaporator DEPOSIT
- ETCH ICP III-V Plasma Etcher
- ETCH ICP General Plasma Etcher
- ETCH ICP Metal Plasma Etcher
- ETCH PECVD
- ETCH Plasma Asher
- ETCH Reactive Ion Etcher
- ETCH STS Deep Reactive Ion Si Etcher
- ETCH UV/Ozone Cleaner
- ETCH XeF2 Etcher
- FURN Filmetrics F20
- FURN MRL Tube 1 High Temp Anneal
- FURN MRL Tube 2 High Temp Oxidation
- FURN MRL Tube 3 Low Temp Oxidation
- FURN MRL Tube 4 Low Temp Anneal
- FURN MRL Tube 6 Unique Anneal
- FURN Pre-Furnace Clean Wet Bench
- FURN Rapid Thermal Annealer
- FURN Thin Film Stress Measurement
- FURN Tystar High Temp Oxidation
- FURN Tystar LPCVD Nitride
- FURN Tystar LPCVD Polysilicon
- LITH Circuit Board UV **
- LITH HMDS primer
- LITH New MJB3 aligner
- LITH Old MJB3 aligner
- LITH Solvent / Develop Bench
- LITH Spinner 1– PR
- LITH Spinner 2- PR including SU8
- LITH Spinner 3–PR
- LITH SU-8 Hotplate
- LITH SU-8 Solvent Bench
- LITH Suss MA6 aligner
- PKG Cooke Vacuum Annealer
- PKG Diamond Scribe
- PKG Dicing Saw 1
- PKG Dicing Saw 2
- PKG Die Attacher
- PKG Gold Ball Wire Bonder
- PKG Indium Evaporator DEPOSIT
- PKG KOH Bath 1
- PKG KOH Bath 2 – relaxed materials restrictions
- PKG Package Annealer
- PKG Polymer Oven
- PKG Wedge Aluminum Wire Bonder
- PKG YES Vacuum Oven
- STEP Image capture
- STEP Nikon i-Line Stepper
- WCAM Cleanroom
- WET Al Etch Bench
- WET BOE / HF Bench
- WET III-V Corrosives Bench
- WET Liftoff Solvent Bench
- WET Nitride Etch Bench
- WET Non-Litho Spin Coat
- WET Piranha Bench
Due to safety and contamination considerations, only certain materials are allowed in these tools. To find the list of allowed materials, log into your FOM account, then choose “Documents” in the left-hand pane. In the window that opens, scroll down to the “Cleanroom” heading, and click on the PDF “Materials Allowed List By Tool”.